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| d a t a sh eet product speci?cation supersedes data of 1997 mar 11 file under integrated circuits, ic11 1997 sep 19 integrated circuits TDA5051 home automation modem
1997 sep 19 2 philips semiconductors product speci?cation home automation modem TDA5051 features full digital carrier generation and shaping modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator high clock rate of 6 bits d/a (digital-to-analog) converter for rejection of aliasing components fully integrated output power stage with overload protection automatic gain control at receiver input 8-bit a/d and narrow digital filtering digital demodulation delivering baseband data easy compliance with en50065-1 with simple coupling network few external components for low cost applications so16 plastic package. applications home appliance control (air conditioning, shutters, lighting, alarms and so on) energy/heating control ask (amplitude shift keying) data transmission using the home power network. general description the TDA5051 is a modem ic, specifically dedicated to ask transmission by means of the home power supply network, at 600 or 1200 baud data rate. it operates from a single 5 v supply. quick reference data note 1. frequency range corresponding to the en50065-1 band. however the modem can operate at any lower oscillator frequency. ordering information symbol parameter conditions min. typ. max. unit v dd supply voltage 4.75 5.0 5.25 v i dd(tot) total supply current f osc = 8.48 mhz reception mode - 28 38 ma transmission mode ( data in =0) z l =30 w- 47 68 ma power down mode - 19 25 ma t amb operating ambient temperature 0 - 70 c f cr carrier frequency note 1 95 132.5 148.5 khz f osc oscillator frequency 6.08 8.48 9.504 mhz v o(rms) output carrier signal on cispr16 load (rms value) 120 - 122 db m v v i(rms) input signal (rms value) 66 - 122 db m v thd total harmonic distortion on cispr16 load with coupling network -- 55 - db z l load impedance 1 30 -w br baud rate - 600 1200 bits/s type number package name description version TDA5051t so16 plastic small outline package: 16 leads; body width 7.5 mm sot162-1 1997 sep 19 3 philips semiconductors product speci?cation home automation modem TDA5051 block diagram fig.1 block diagram. handbook, full pagewidth mgk006 1 4 7 dgnd 5 6 10 agnd 12 v dda v ddap tx out rx in apgnd pd 13 v ddd 311 10 9 15 14 8 2 8 u h l d 5 16 rom dac clock filter clock oscillator data out osc2 osc1 digital demodulator digital bandpass filter ? 2 control logic d/a modulated carrier TDA5051 a/d test1 scantest u/d count peak detect power drive with protection 6 data in clk out 1997 sep 19 4 philips semiconductors product speci?cation home automation modem TDA5051 pinning symbol pin description da t a in 1 digital data input (active low) da t a out 2 digital data output (active low) v ddd 3 digital supply voltage clk out 4 clock output dgnd 5 digital ground scantest 6 test input (low in application) osc1 7 oscillator input osc2 8 oscillator output apgnd 9 analog ground for power ampli?er tx out 10 analog signal output v ddap 11 analog supply voltage for power ampli?er agnd 12 analog ground v dda 13 analog supply voltage rx in 14 analog signal input pd 15 power-down input (active high) test1 16 test input (high in application) fig.2 pin configuration. handbook, halfpage mgk005 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 data in data out v ddd clk out dgnd scantest osc1 osc2 apgnd tx out v ddap agnd v dda rx in pd test1 TDA5051t 1997 sep 19 5 philips semiconductors product speci?cation home automation modem TDA5051 functional description both transmission and reception stages are controlled either by the master clock of the microcontroller, or by the on-chip reference oscillator connected to a crystal. this holds for the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. the interface with the power network is made by means of a lc network (see fig.18). the device includes a power output stage able to feed a 120 db m v (rms) signal on a typical 30 w load. to reduce power consumption, the ic is disabled by a power-down input (pin pd): in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin clk out . for low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller (see section power-down mode). when the circuit is connected to an external clock generator (see fig.6), the clock signal must be applied at pin osc1 (pin 7); osc2 (pin 8) must be left open. use of the on-chip clock circuitry is shown in fig.7. all logic inputs and outputs are compatible with ttl/cmos levels, providing an easy connection to a standard microcontroller i/o port. the digital part of the ic is fully scan-testable. two digital inputs, scantest and test1, are used for production test: these pins must be left open in functional mode (correct levels are internally defined by pull-up/down resistors). transmission mode the carrier frequency is generated by the scanning of a rom memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator, thus providing strict stability with respect to environmental conditions. high frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling lc network and do not cause any significant disturbance. the data modulation is applied through pin data in and smoothly applied by specific digital circuitry to the carrier (shaping). harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to cispr16 and en50065-1 recommendations). a - 55 db total harmonic distortion is reached when using the typical lc coupling network (or an equivalent filter). the d/a converter and the power stage are set in order to provide a maximum signal level of 122 db m v (rms) at the output. the output of the power stage (tx out ) always has to be connected to a decoupling capacitor, because of a dc level of 0.5v dd at this pin, present even when the device is not transmitting. this pin also has to be protected against overvoltage and negative transient signals . the dc level of tx out can be used to bias an unipolar transient suppressor, as shown in the application diagram (see fig.18). direct connection to the mains is done through a lc network for low-cost applications. however, a hf signal transformer could be used when power-line insulation has to be performed. receiving mode the input signal received by the modem is applied to a wide range input amplifier with automatic gain control (agc) ( - 6 to +30 db). this is basically for noise performance improvement and signal level adjustment that ensures a maximum sensitivity of the a/d converter. then an 8 bit a/d conversion is performed, followed by digital bandpass filtering, in order to meet the cispr normalization and to comply with some additional limitations encountered in current applications. after digital demodulation, the baseband data signal is made available after pulse shaping. the signal pin (rx in ) is a high-impedance input, which has to be protected and dc decoupled for the same reasons as with pin tx out . the high sensitivity (66 db m v) of this input requires an efficient 50 hz rejection filter (realized by the lc coupling network) also used as an anti-aliasing filter for the internal digital processing (see fig.18). caution in transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. in this mode, the gain chosen before the beginning of the transmission is stored, and the agc is internally set to - 6db as long as data in is low. then, the old gain setting is automatically restored . 1997 sep 19 6 philips semiconductors product speci?cation home automation modem TDA5051 data format t ransmission mode the data input ( data in ) is active low: this means that a burst is generated on the line (pin tx out ) when pin data in is low. pin tx out is in high-impedance state as long as the device is not transmitting. successive logic 1s are treated in a nrz mode (see pulse shape description in figs 8 and 9). r eceiving mode the data output (pin data out ) is active low; this means that the data output is low when a burst is received. pin data out remains low as long as a burst is received. power-down mode power-down input (pin pd) is active high; this means that the power consumption is minimal when pin pd is high. all functions, except clock generation, are disabled then. limiting values in accordance with the absolute maximum rating system (iec 134). handling inputs and outputs are protected against electrostatic discharge in normal handling. however, to be totally safe, it is desirable to take normal precautions appropriate to handling mos devices. symbol parameter min. max. unit v dd supply voltage 4.5 5.5 v f osc oscillator frequency - 12 mhz t stg storage temperature - 50 +150 c t amb operating ambient temperature - 10 +80 c t j junction temperature - 125 c 1997 sep 19 7 philips semiconductors product speci?cation home automation modem TDA5051 characteristics v ddd =v dda =5v 5%; t amb = 0 to 70 c; v ddd connected to v dda ; dgnd connected to agnd. symbol parameter conditions min. typ. max. unit supply v dd supply voltage 4.75 5 5.25 v i dd(rx/tx)(tot) total analog + digital supply current; tx or rx mode v dd =5v 5% - 28 38 ma i dd(pd)(tot) total analog + digital supply current; power-down mode v dd =5v 5%; pd = high - 19 25 ma i dd(pamp) power ampli?er supply current in transmission mode v dd =5v 5%; z l =30 w ; da t a in = low - 19 30 ma i dd(pamp)(max) maximum power ampli?er supply current in transmission mode v dd =5v 5%; z l =1 w ; da t a in = low - 76 - ma da t a in input, pd input: da t a out output, clk out output v ih high-level input voltage 0.2v dd + 0.9 - v dd + 0.5 v v il low-level input voltage - 0.5 - 0.2v dd - 0.1 v v oh high-level output voltage i oh = - 1.6 ma 2.4 -- v v ol low-level output voltage i ol = 1.6 ma -- 0.45 v osc1 input and osc2 output (osc2 only used for driving external quartz crystal; must be left open when using an external clock generator) v ih high-level input voltage 0.7v dd - v dd + 0.5 v v il low-level input voltage - 0.5 - 0.2v dd - 0.1 v v oh high-level output voltage i oh = - 1.6 ma 2.4 -- v v ol low-level output voltage i ol = 1.6 ma -- 0.45 v clock f osc oscillator frequency 6.080 - 9.504 mhz ratio between oscillator and carrier frequency - 64 - ratio between oscillator and clock output frequency - 2 - f osc f cr -------- f osc f clkout ------------------- - 1997 sep 19 8 philips semiconductors product speci?cation home automation modem TDA5051 transmission mode f cr carrier frequency f osc = 8.48 mhz - 132.5 - khz t su set-up time of the shaped burst f osc = 8.48 mhz; see fig.8 - 170 -m s t h hold time of the shaped burst f osc = 8.48 mhz; see fig.8 - 170 -m s t w(di)(min) minimum pulse width of da t a in signal f osc = 8.48 mhz; see fig.8 - 190 -m s v o(rms) output carrier signal (rms value) z l = cispr16 da t a in = low 120 - 122 db m v i o(max) power ampli?er maximum output current (peak value) z l =1 w ; da t a in = low - 160 - ma z o output impedance of the power ampli?er - 5 -w v o output dc level at tx out - 2.5 - v thd total harmonic distortion on cispr16 load with the coupling network (measured on the ?rst ten harmonics) v o(rms) = 121 db m v on cispr16 load; f osc = 8.48 mhz; da t a in = low (no modulation); see figs 3 and 16 -- 55 - db b - 20db bandwidth of the shaped output signal (at - 20 db) on cispr16 load with the coupling network v o(rms) = 121 db m v on cispr16 load; f osc = 8.48 mhz; da t a in = 300 hz; duty factor = 50%; see fig.4 - 3000 - hz reception mode v i(rms) analog input signal (rms value) 68 - 122 db m v v i dc level at pin rx in - 2.5 - v z i rx in input impedance - 50 - k w r agc automatic gain control range - 36 - db t c(agc) automatic gain control time constant f osc = 8.48 mhz; see fig.5 - 296 -m s t d(dem)(su) demodulation delay set-up time f osc = 8.48 mhz; see fig.15 - 410 460 m s t d(dem)(h) demodulation delay hold time f osc = 8.48 mhz; see fig.15 - 330 380 m s b det detection bandwidth f osc = 8.48 mhz - 3 - khz symbol parameter conditions min. typ. max. unit 1997 sep 19 9 philips semiconductors product speci?cation home automation modem TDA5051 ber bit error rate f osc = 8.48 mhz; 600 baud; s/n = 35 db; signal 76 db m v; see fig.17 - 1 - 1 10 - 4 power-up timing t d(pu)(tx) delay between power-up and da t a in in transmission mode xtal = 8.48 mhz; c1 = c2 = 27 pf; r p = 2.2 m w ; see fig.10 - 1 -m s t d(pu)(rx) delay between power-up and da t a out in reception mode xtal = 8.48 mhz; c1 = c2 = 27pf; r p = 2.2 m w ; f rxin = 132.5 khz; 120 db m v sinewave; see fig.11 - 1 -m s power-down timing t d(pd)(tx) delay between pd = 0 and da t a in in transmission mode f osc = 8.48 mhz; see fig.12 - 10 -m s t d(pd)(rx) delay between pd = 0 and da t a out in reception mode f osc = 8.48 mhz; f rxin = 132.5 kh; 120 db m v sinewave; see fig.13 - 500 -m s t active(min) minimum active time with t = 10 ms power-down period in reception mode f osc = 8.48 mhz; f rxin = 132.5 kh; 120 db m v sinewave; see fig.14 - 1 -m s symbol parameter conditions min. typ. max. unit 1997 sep 19 10 philips semiconductors product speci?cation home automation modem TDA5051 fig.3 carrier spectrum. resolution bandwidth = 9 khz; top: 0 dbv (rms) = 120 db m v (rms); marker at - 5 dbv (rms) = 115 db m v (rms); the cispr16 network provides an attenuation of 6 db, so the signal amplitude is 121 db m v (rms). d book, full pagewidth - 100 0 mgk834 132.5 khz v o(rms) (dbv) 10 6 10 5 f (hz) 1997 sep 19 11 philips semiconductors product speci?cation home automation modem TDA5051 fig.4 shaped signal spectrum. resolution bandwidth = 100 hz; b - 20db = 3000 hz (2 1500 hz). handbook, full pagewidth - 60 117.5 132.5 dbv (rms) 147.5 f (khz) - 10 mbh664 1500 hz 20 db fig.5 agc time constant definition (not to scale). handbook, full pagewidth mgk011 v rxin v (i) 0 8.68 db agc range t c(agc) (agc time constant) + 30 db - 6 db g agc modulated sinewave 122 db m v amplitude t 1997 sep 19 12 philips semiconductors product speci?cation home automation modem TDA5051 timing con?gurations for clock table 1 clock oscillator parameters f osc oscillator frequency f cr carrier frequency 1 2 f osc clock output frequency external components 6.080 to 9.504 mhz 95 to 148.5 khz 3.040 to 4.752 mhz c1 = c2 = 27 to 47 pf; r p = 2.2 to 4.7 m w ; xtal = standard quartz crystal fig.6 external clock. for parameter description see table 1. handbook, full pagewidth mgk007 micro- controller clk out gnd TDA5051 osc1 dgnd xtal f osc 7 5 fig.7 typical configuration for on-chip clock circuit. for parameter description see table 1. handbook, full pagewidth mgk008 micro- controller clk in gnd TDA5051 r p clk out dgnd osc2 osc1 xtal f osc / 2 4 5 8 7 c1 c2 1997 sep 19 13 philips semiconductors product speci?cation home automation modem TDA5051 table 2 calculation of parameters depending of the clock frequency symbol parameter conditions unit f osc oscillator frequency with on-chip oscillator: frequency of the crystal quartz; with external clock: frequency of the signal applied at osc1 hz f clkout clock output frequency 1 2 f osc hz f cr carrier frequency/digital ?lter tuning frequency 1 64 f osc hz t su set-up time of the shaped burst or s t h hold time of the shaped burst or s t w(di)(min) minimum pulse width of da t a in signal t su + s t w(burst)(min) minimum burst time of v o(dc) signal t w(di)(min) +t h s t c(agc) agc time constant s t su(demod) demodulation set-up time ( ? max.) s t h(demod) demodulation hold time ( ? max.) s 23 f cr ------ 1472 f osc 23 f cr ------ 1472 f osc ------------ - 1 f cr ----- 2514 f osc ------------ - 3700 f osc ------------ - 3050 f osc ------------ - fig.8 relationship between data in and tx out (see table 3). handbook, full pagewidth mgk837 t w(burst) t su 0 v o(dc) t h t w(burst)(min) tx out t w(di) t w(di)(min) data in (1) (2) (3) (1) t w(di) >t w(di)(min) (2) t w(di)(min) =t su + (3) t w(di)(min) 1997 sep 19 15 philips semiconductors product speci?cation home automation modem TDA5051 timing diagrams fig.10 timing diagram during power-up in transmission mode. data in is an edge-sensitive input and must be high before starting a transmission. handbook, full pagewidth mgk015 t d(pu)(tx) tx out data in v dd 90% v dd clk out high not defined clock stable fig.11 timing diagram during power-up in reception mode. handbook, full pagewidth mgk016 t d(pu)(rx) t d(dem)(h) rx in data out v dd 90% v dd clk out high not defined not defined clock stable 1997 sep 19 16 philips semiconductors product speci?cation home automation modem TDA5051 fig.12 power-down sequence in transmission mode. handbook, full pagewidth mgk017 t d(pd)(tx) normal operation wrong operation tx out delayed by pd tx out data in pd fig.13 power-down sequence in reception mode. handbook, full pagewidth mgk018 t d(dem)(su) t d(pd)(rx) t d(pd)(rx) data out delayed by pd data out rx in pd fig.14 power saving by dynamic control of power-down. handbook, full pagewidth mgk845 t active(min) i dd(rx) i dd(pd) i dd t data out rx in pd 0 1997 sep 19 17 philips semiconductors product speci?cation home automation modem TDA5051 test information fig.15 test set-up for measuring demodulation delay. handbook, full pagewidth 30 w 1 m f 10 nf xtal data in data out t d(dem)(su) t d(dem)(h) data out data in tx out /rx in oscilloscope y1 TDA5051 (to be tested) pulse generator 300 hz 50% y2 tx out rx in f osc 2 1 10 14 8 7 mgk012 1997 sep 19 18 philips semiconductors product speci?cation home automation modem TDA5051 fig.16 test set-up for measuring thd and bandwidth of the tx out signal. (1) square wave ttl signal 300 hz, duty factor = 50% for measuring signal bandwidth (see spectrum fig.3). (2) data in = low for measuring total harmonic distortion (see spectrum fig.3). (3) tuned for f cr = 132.5 khz. (4) the cispr16 network provides a - 6 db attenuation. handbook, full pagewidth mgk013 data in TDA5051 power supply spectrum analyser 50 w 10 osc1 12, 5, 9 1 7 osc2 8 13, 3, 11 tx out agnd, dgnd, apgnd v dda, v ddd, v ddap 5 w 5 w 50 w 10 m f 33 nf 250 nf 250 nf 47 m h 50 m h 50 m h 33 nf 47 m h coupling network (3) cispr16 network (4) + 5 v (2) (1) 1997 sep 19 19 philips semiconductors product speci?cation home automation modem TDA5051 fig.17 test set-up for measuring bit error rate (ber). (1) see fig.16. handbook, full pagewidth mgk014 TDA5051 (to be tested) coupling network (1) v24/ttl interface 78 78 14 2 data out data in rx in out TDA5051 coupling network (1) spectrum analyser 50 w white noise generator 10 12, 5, 9 12, 5, 9 1 osc1 osc2 osc1 osc2 tx out in agnd, dgnd, apgnd agnd, dgnd, apgnd v24 serial data analyser parameters 600 baud pseudo random sequence: 2 9 - 1 bits long data in data out rxd txd xtal = 8.48 mhz out in out + + 1997 sep 19 20 philips semiconductors product speci?cation home automation modem TDA5051 application information fig.18 application diagram without power line insulation. handbook, full pagewidth mgk020 250 v (ac) max t 630 ma 1 mh 68 w (2 w) 33 nf 250 v (ac) 47 m h mov 250 v (ac) 33 nf 47 m h 100 m f (16 v) 470 m f (16 v) 7v5 (1.3 w) 1n4006 1n4006 2 m f 250 v (ac) 10 nf v ddd v ddap apgnd agnd dgnd v dda rx in tx out p6ke6v8 1 m f (16 v) 14 1 + 5 v + 5 v 2 micro- controller 4 7 osc1 xtal 8.48 mhz 2.2 m w osc2 859 12 3 3 1 2 13 11 15 47 nf 78l05 pd 27 pf 27 pf 10 data in data out clk out TDA5051 1997 sep 19 21 philips semiconductors product speci?cation home automation modem TDA5051 fig.19 gain (curve 1) and input impedance (curve 2) of the coupling network (f cr = 132.5 khz); l = 47 m h; c = 33 nf. main features of the coupling network: 50 hz rejection >80 db; anti-aliasing for the digital filter >50 db at the sampling frequency ( 1 2 f osc ). input impedance always higher than 10 w within the 95 to 148.5 khz band. handbook, full pagewidth 20 0 - 20 - 40 - 60 - 80 - 100 mbh907 10 gain (db) 10 2 10 10 2 10 3 10 3 10 4 10 5 f (hz) input impedance ( w ) 10 6 10 7 1 2 fig.20 output voltage versus line impedance (with coupling network); l = 47 m h; c = 33 nf. main features of the coupling network: 50 hz rejection >80 db; anti-aliasing for the digital filter >50 db at the sampling frequency ( 1 2 f osc ). input impedance always higher than 10 w within the 95 to 148.5 khz band. handbook, halfpage 130 120 110 100 mbh908 110 v o (db m v) z line ( w ) 10 2 1997 sep 19 22 philips semiconductors product speci?cation home automation modem TDA5051 fig.21 application diagram with power line insulation. handbook, full pagewidth mgk021 250 v (ac) max t 630 ma 1 va 230 v 6 v 100 w (0.5 w) toko t1002 n = 1 470 nf 250 v (ac) mov 250 v (ac) 46 3 n = 4 n = 1 6.8 nf 33 nf 3.3 m h 470 nf 2 1 100 m f (16 v) 470 m f (16 v) v ddd v ddap v dda rx in tx out p6ke6v8 14 1 + 5 v + 5 v 2 micro- controller 4 7 osc1 xtal 8.48 mhz 2.2 m w osc2 859 12 3 3 1 2 13 11 15 47 nf fdb08 78l05 pd 27 pf 27 pf 10 TDA5051 apgnd agnd dgnd data in data out clk out 1997 sep 19 23 philips semiconductors product speci?cation home automation modem TDA5051 package outline unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013aa pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale so16: plastic small outline package; 16 leads; body width 7.5 mm sot162-1 95-01-24 97-05-22 1997 sep 19 24 philips semiconductors product speci?cation home automation modem TDA5051 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). re?ow soldering reflow soldering techniques are suitable for all so packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. wave soldering wave soldering techniques can be used for all so packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. repairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 1997 sep 19 25 philips semiconductors product speci?cation home automation modem TDA5051 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. 1997 sep 19 26 philips semiconductors product speci?cation home automation modem TDA5051 notes 1997 sep 19 27 philips semiconductors product speci?cation home automation modem TDA5051 notes internet: http://www.semiconductors.philips.com philips semiconductors C a worldwide company ? philips electronics n.v. 1997 sca55 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 1231, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: rua do rocio 220, 5th floor, suite 51, 04552-903 s?o paulo, s?o paulo - sp, brazil, tel. +55 11 821 2333, fax. +55 11 829 1849 spain: balmes 22, 08007 barcelona, tel. +34 3 301 6312, fax. +34 3 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 632 2000, fax. +46 8 632 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2686, fax. +41 1 481 7730 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2865, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 625 344, fax.+381 11 635 777 for all other countries apply to: philips semiconductors, marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 160 1010, fax. +43 160 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 200 733, fax. +375 172 200 773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 689 211, fax. +359 2 689 102 canada: philips semiconductors/components, tel. +1 800 234 7381 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. +45 32 88 2636, fax. +45 31 57 0044 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615800, fax. +358 9 61580920 france: 4 rue du port-aux-vins, bp317, 92156 suresnes cedex, tel. +33 1 40 99 6161, fax. +33 1 40 99 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 23 53 60, fax. +49 40 23 536 300 greece: no. 15, 25th march street, gr 17778 tavros/athens, tel. +30 1 4894 339/239, fax. +30 1 4814 240 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: see singapore ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381 middle east: see italy printed in the netherlands 297027/1200/02/pp28 date of release: 1997 sep 19 document order number: 9397 750 02513 |
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